Inventor · Gilbert, AZ, US

Ismail Emesh

39Patents
13h-index
41Co-inventors
81Inventor score

Filing activity: Apr 30, 1992 → Oct 17, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US5354712A Method for forming interconnect structures for integrated circuits Electricity 327 Expired
US5789303A Method of adding on chip capacitors to an integrated circuit Emerging Cross-Sectional Technologies 147 Expired
US5452178A Structure and method of making a capacitor for an intergrated circuit Electricity 124 Expired
US5563762A Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit Emerging Cross-Sectional Technologies 109 Expired
US7449098B1 Method for planar electroplating Electricity 86 Expired
US5407698A Deposition of tungsten Electricity 71 Expired
US6736952B2 Method and apparatus for electrochemical planarization of a workpiece Electricity 63 Expired
US5330931A Method of making a capacitor for an integrated circuit Electricity 62 Expired
US5728603A Method of forming a crystalline ferroelectric dielectric material for an integrated circuit Electricity 58 Expired
US6066581A Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits Electricity 36 Expired
US5358889A Formation of ruthenium oxide for integrated circuits Electricity 34 Expired
US6802955B2 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface Electricity 29 Expired
US6337032B1 Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits Electricity 22 Expired
US6572755B2 Method and apparatus for electrochemically depositing a material onto a workpiece surface Electricity 13 Expired
US7297239B2 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface Electricity 6 Expired
US8357599B2 Seed layer passivation Electricity 5 Active
US7201828B2 Planar plating apparatus Electricity 4 Expired
US9768060B2 Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD Electricity 4 Active
US7033464B2 Apparatus for electrochemically depositing a material onto a workpiece surface Electricity 4 Expired
US9245798B2 Semiconductor reflow processing for high aspect ratio fill Electricity 4 Active
US9425092B2 Methods for producing interconnects in semiconductor devices Electricity 4 Active
US6974525B2 Method and apparatus for electrochemical planarization of a workpiece Electricity 2 Expired
US9805976B2 Co or Ni and Cu integration for small and large features in integrated circuits Electricity 2 Active
US9496145B2 Electrochemical plating methods Electricity 2 Active
US10062607B2 Methods for producing interconnects in semiconductor devices Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.