Preparation of passivated chip-on-board electronic devices

US6573124B1 · kind B1 · utility

Assignee

• HUGHES ELECTRONICS LIMITED · US

Inventors

• Shih-chien Chou · Cerritos, US
• Steven R. Felstein · Redondo Beach, US
• Ching P. Lo · Rancho Palos Verdes, US
• Daniel A. Huang · Calabasas, US
• Richard Fanucchi · Willow View Lane, US
• Gregory L. Mayhew · El Segundo, US
• Lydia H. Simanyi · Santa Ana, US

Key dates

• Filing date: May 3, 1999
• Grant date: Jun 3, 2003
• Expiry date: May 3, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49982
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip-on-board electronic device includes an electronic device die affixed to a printed circuit board, and electrically interconnected thereto by wirebonds. The electronic device is protected by coating it with a layer of silicon oxynitride and, optionally, an overlying thin layer of a conformal coating such as parylene. Under some circumstances, a protective layer of an organic material may be used instead of the layer of silicon oxynitride. The chip-on-board electronic device may be protected with an overlying layer of the conformal coating.