Retaining ring interconnect used for 3-D stacking
US6573461B2 · kind B2 · utility
28Cited by
74References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By performing a heat compression process, the retaining rings are connected to encompass the conductive paste. A eutectic bond is thus formed to bond the two PCB substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.