DPAC Technologies Corp.
5Patents
0Active
5Granted
29Portfolio score
Filing activity: Jun 25, 2001 → Jul 24, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6514793B2 | Stackable flex circuit IC package and method of making same | Electricity | 70 | Expired |
| US6660561B2 | Method of assembling a stackable integrated circuit chip | Electricity | 68 | Expired |
| US6566746B2 | Panel stacking of BGA devices to form three-dimensional modules | Electricity | 51 | Expired |
| US6573461B2 | Retaining ring interconnect used for 3-D stacking | Electricity | 28 | Expired |
| US6573460B2 | Post in ring interconnect using for 3-D stacking | Emerging Cross-Sectional Technologies | 7 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.