Semiconductor device with internal heat dissipation
US6573538B2 · kind B2 · utility
10Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management system for a semiconductor chip including at least one region of thermally conductive material included internally within the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.