Reliability of vias and diagnosis by e-beam probing
US6573735B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jun 8, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Electronic devices, such as IC devices, are tested by determining a failure net within the electronic device that is causing a device failure. After identifying the failure net, the failure net is locally stressed. The stress is applied so that only the net being tested is subjected to the stress, and the remaining nets and components of the device are not stressed. A change in a signal produced by the failure net is observed while the failure net is being subjected to the stress. Testing in this manner assists in identifying the failure net as a failure source of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.