Wire bonding apparatus with spurious vibration suppressing structure
US6575348B2 · kind B2 · utility
3Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.