Laminated socket contacts
US6575766B1 · kind B1 · utility
13Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2002 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Feb 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.