Apparatus and method for polishing multiple semiconductor wafers in parallel
US6575818B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B27/0023
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers to polish a corresponding number of semiconductor wafers on a single polishing pad in parallel. In one embodiment, the wafer carriers are used to transfer semiconductor wafers between one or more wafer transfer stations and the polishing pad. In other embodiments, one or more wafer transfer arms are used to transfer the semiconductor wafers between the wafer transfer station(s) and the wafer carriers. The CMP apparatus is configured to sequentially process semiconductor wafers to increase the throughput of the apparatus. In addition, the components of the CMP apparatus are arranged such that the footprint of the apparatus is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.