Oriol Inc.
19Patents
1Active
19Granted
35Portfolio score
Filing activity: Feb 8, 2001 → Jul 28, 2006 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6744196B1 | Thin film LED | Electricity | 93 | Expired |
| US6949395B2 | Method of making diode having reflective layer | Electricity | 63 | Expired |
| US6822202B2 | Semiconductor processing temperature control | Electricity | 58 | Expired |
| US6841802B2 | Thin film light emitting diode | Electricity | 55 | Expired |
| US6818532B2 | Method of etching substrates | Electricity | 34 | Expired |
| US6905398B2 | Chemical mechanical polishing tool, apparatus and method | Performing Operations; Transporting | 18 | Expired |
| US6586336B2 | Chemical-mechanical-polishing station | Electricity | 17 | Expired |
| US6835118B2 | Rigid plate assembly with polishing pad and method of using | Performing Operations; Transporting | 12 | Expired |
| US7069984B2 | Multi-channel temperature control system for semiconductor processing facilities | Mechanical Engineering; Lighting; Heating | 9 | Expired |
| US6561881B2 | System and method for chemical mechanical polishing using multiple small polishing pads | Performing Operations; Transporting | 9 | Expired |
| US6949466B2 | CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines | Electricity | 8 | Expired |
| US7004815B2 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers | Performing Operations; Transporting | 8 | Expired |
| US7104867B2 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers | Performing Operations; Transporting | 8 | Expired |
| US7186165B2 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers | Performing Operations; Transporting | 7 | Active |
| US6942545B2 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers | Performing Operations; Transporting | 7 | Expired |
| US6575818B2 | Apparatus and method for polishing multiple semiconductor wafers in parallel | Performing Operations; Transporting | 4 | Expired |
| US6949177B2 | System and method for processing semiconductor wafers using different wafer processes | Electricity | 3 | Expired |
| US7180036B2 | Semiconductor processing temperature control | Electricity | 3 | Expired |
| US7225864B2 | Multi-channel temperature control system for semiconductor processing facilities | Mechanical Engineering; Lighting; Heating | 2 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.