Method and apparatus for drilling microvia holes in electrical circuit interconnection packages
US6576869B1 · kind B1 · utility
57Cited by
5References
52Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0035
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.