Exitech Limited
5Patents
3Active
5Granted
38Portfolio score
Filing activity: Nov 27, 2000 → Aug 25, 2006 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6576869B1 | Method and apparatus for drilling microvia holes in electrical circuit interconnection packages | Electricity | 57 | Expired |
| US8344285B2 | Process and apparatus for ablation | Performing Operations; Transporting | 10 | Active |
| US7863542B2 | Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method | Performing Operations; Transporting | 10 | Active |
| US7371993B2 | Method for laser micromachining | Performing Operations; Transporting | 4 | Expired |
| US8581140B2 | Laser processing apparatus, laser processing head and laser processing method | Performing Operations; Transporting | 2 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.