High-throughput materials processing system
US6577380B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02691
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A materials-processing system based on projection irradiation using a pulsed-laser source is disclosed. The salient features include a novel illumination system containing a homogenizer that produces a self-luminous light beam of selected cross-section, spatially uniform intensity, and selected numerical aperture, as well as a novel high-efficiency, energy-recycling exposure system that provides pulse-duration extension. The output of the pulsed-laser source is shaped, optionally attenuated, and homogenized, and the pulse duration is extended by the illumination system, including beam-shaping optics, homogenizer, and optionally a condenser lens or pulse-extender-plate (PEP). The illumination is imaged either onto the mask, which is in turn imaged onto the substrate, or the illumination is imaged onto the substrate directly. The high-fluence irradiation effects a desired physical change in the material, for example melting and solidification as required in the sequential lateral solidification (SLS) process. Concurrently, the substrate and/or mask are translated, in a manner precisely coordinated with the laser pulses, as dictated by the particular process being conducted. The high …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.