Pillar connections for semiconductor chips and method of manufacture
US6578754B1 · kind B1 · utility
392Cited by
13References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2000 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Apr 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.