Patent assignee · SG · COMPANY

ADVANPACK SOLUTIONS PTE LTD.

45Patents
31Active
45Granted
49Portfolio score

Filing activity: Apr 27, 2000 → Sep 19, 2018 · 12 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6578754B1 Pillar connections for semiconductor chips and method of manufacture Electricity 392 Expired
US6550666B2 Method for forming a flip chip on leadframe semiconductor package Electricity 210 Expired
US6592019B2 Pillar connections for semiconductor chips and method of manufacture Electricity 167 Expired
US7462942B2 Die pillar structures and a method of their formation Electricity 136 Expired
US6681982B2 Pillar connections for semiconductor chips and method of manufacture Electricity 108 Expired
US6510976B2 Method for forming a flip chip semiconductor package Electricity 57 Expired
US6732913B2 Method for forming a wafer level chip scale package, and package formed thereby Electricity 55 Expired
US7087458B2 Method for fabricating a flip chip package with pillar bump and no flow underfill Electricity 55 Expired
US7456496B2 Package design and method of manufacture for chip grid array Electricity 40 Active
US6750082B2 Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip Electricity 33 Expired
US7795071B2 Semiconductor package for fine pitch miniaturization and manufacturing method thereof Electricity 28 Active
US6734039B2 Semiconductor chip grid array package design and method of manufacture Emerging Cross-Sectional Technologies 23 Expired
US6929981B2 Package design and method of manufacture for chip grid array Electricity 23 Expired
US6599775B2 Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor Electricity 23 Expired
US6467676B1 Fluxing adhesive Electricity 20 Expired
US8207608B2 Interconnections for fine pitch semiconductor devices and manufacturing method thereof Electricity 17 Active
US6365435B1 Method for producing a flip chip package Emerging Cross-Sectional Technologies 17 Expired
US9653323B2 Manufacturing method of substrate structure having embedded interconnection layers Electricity 8 Active
US8709874B2 Manufacturing method for semiconductor device carrier and semiconductor package using the same Emerging Cross-Sectional Technologies 3 Active
US9219027B2 Semiconductor device carrier and semiconductor package using the same Emerging Cross-Sectional Technologies 2 Active
US9301391B2 Substrate structure, semiconductor package device, and manufacturing method of substrate structure Electricity 2 Active
US9136215B2 Manufacturing method for semiconductor package Electricity 2 Active
US8846519B2 Interconnections for fine pitch semiconductor devices and manufacturing method thereof Electricity 1 Active
US9379044B2 Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof Electricity 1 Active
US9892916B2 Manufacturing method of package substrate and package manufacturing method of semiconductor device Electricity 1 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.