Flip chip with solder pre-plated leadframe including locating holes
US6580165B1 · kind B1 · utility
30Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2000 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip with a solder pre-plated leadframe that includes locating holes. The leadframe does not include a die attach pad. Two of the leads include a locating or alignment hole for receiving a solder bump of the bumped die. The remaining leads include die contact areas for placement of the die thereon with the solder bumps contacting the die contact areas. The leads with the die contact areas are downset. The downset is approximately 4 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.