Vented vias for via in pad technology yield improvements
US6580174B2 · kind B2 · utility
61Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Sep 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus that includes a substrate, one or more via in pads in the substrate; and one or more vents in at least one of the one or more via in pads, the one or more vents connecting an outer diameter of at least one of the one or more via in pads to a diameter larger than the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.