John Dungan
12Patents
7h-index
7Co-inventors
51Inventor score
Filing activity: Sep 26, 2001 → Jun 11, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6787443B1 | PCB design and method for providing vented blind vias | Emerging Cross-Sectional Technologies | 120 | Expired |
| US6580174B2 | Vented vias for via in pad technology yield improvements | Emerging Cross-Sectional Technologies | 61 | Expired |
| US6941537B2 | Standoff devices and methods of using same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7583513B2 | Apparatus for providing an integrated printed circuit board registration coupon | Electricity | 18 | Expired |
| US7084354B2 | PCB method and apparatus for producing landless interconnects | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7325303B2 | Three-dimensional flexible interposer | Emerging Cross-Sectional Technologies | 7 | Active |
| US7201583B2 | Three-dimensional flexible interposer | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7061116B2 | Arrangement of vias in a substrate to support a ball grid array | Electricity | 3 | Expired |
| US7385288B2 | Electronic packaging using conductive interproser connector | Electricity | 3 | Active |
| US7147141B2 | Preconditioning via plug material for a via-in-pad ball grid array package | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6667090B2 | Coupon registration mechanism and method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7241680B2 | Electronic packaging using conductive interposer connector | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.