Method for forming pin-form wires and the like
US6581283B2 · kind B2 · utility
110Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jul 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.