Target fabrication method for cylindrical cathodes
US6582572B2 · kind B2 · utility
30Cited by
19References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jul 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49906
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fabricating multiple annular rings including each of the basic metal constituents of the desired alloy and attaching the annular rings to the cooling tube such that the exposed outer portions of the annular rings provide a homogeneous layer of the desired alloy on the non-planar substrates during sputtering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.