CMP composition containing silane modified abrasive particles
US6582623B1 · kind B1 · utility
113Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jul 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising a dispersion of silane modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features and oxide features using the polishing compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.