Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
US6583364B1 · kind B1 · utility
11Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Aug 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention pertains to a multilayer flexible wiring board.The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.