Patent · US Expired

Integrated electronic-optoelectronic devices and method of making the same

US6583445B1 · kind B1 · utility

58Cited by
24References
26Claims
0Family size

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Key dates

Filing dateSep 8, 2000
Grant dateJun 24, 2003
Priority date
Expiry dateOct 7, 2020

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/183
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An integrated electronic-optoelectronic module comprising: an ultrathin silicon-on-sapphire composite substrate; at least one electronic device fabricated in the ultrathin silicon; and at least one optoelectronic device bonded to the ultrathin silicon-on-sapphire composite substrate and in electrical communication with the at least one electronic device fabricated in the ultrathin silicon layer. For example, VCSELs and photodetectors are integrated with CMOS electronic circuitry to provide useful modules for electro-optical interconnects for computing and switching systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.