Lead frame for an integrated circuit chip (integrated circuit peripheral support)
US6583501B2 · kind B2 · utility
0Cited by
15References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Feb 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.