Method for producing a microelectronic component of sandwich construction

US6584681B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Leo Lorenz · Farmington, US
• Michael Kaindl · Brackenheim, DE
• Herbert Schwarzbauer · Munich, DE
• Gerhard Munzing · Wilmslow, GB
• Peter Stern · New York, US
• Manfred Bruckmann · Wendelstein, DE

Key dates

• Filing date: Oct 9, 2001
• Grant date: Jul 1, 2003
• Expiry date: Dec 9, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49144
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces electrically connected to the first conductor track plane, and second contact faces opposite the first sides. The method furthermore includes providing a second substrate which has a second conductor track plane with contact points, securing electrically conductive balls to the contact points of the second conductor track plane using an electrically conductive, flexible adhesive, applying an electrically conductive, flexible adhesive to the second contact faces of the plurality of semiconductor chips, and joining the first substrate and the second substrate together.