Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
US6585150B1 · kind B1 · utility
0Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Oct 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.