Apparatus and method for feeding slurry
US6585560B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 28, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.