Leadless plastic chip carrier with partial etch die attach pad
US6585905B1 · kind B1 · utility
163Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the thickness of the portion of the die attach pad. A plurality of wire bonds connect the die attach pad and the contact pads. An overmold covers the semiconductor die and all except one surface of the at least one row of contact pads and the die attach pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.