Chemical-mechanical-polishing station
US6586336B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Dec 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A small footprint, integrated and automated semiconductor wafer processing system for planarizing semiconductor wafers. That processing system includes a wafer load station, at least one CMP polishing system, and at least one cleaning system. Also included is at least one wafer unload station and a robotic system. The robotic system, which includes from two to six robotic movers, moves semiconductor wafers through the semiconductor wafer processing system. The semiconductor wafer processing system can also include a buffer system for temporarily holding semiconductor wafers. The buffer system, the robotic system, the cleaning system, the wafer load station, and/or the wafer unload station in some applications are capable of Z-axis motion. CMP polishing systems and cleaning systems can be vertically or linearly stacked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.