Printed wiring board with high density inner layer structure
US6586687B2 · kind B2 · utility
7Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Sep 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed wiring board (PWB) comprises an inner high density circuit routing component laminated within the wiring board, and plated through holes electrically coupling the inner high density circuit to a conductive pattern located on a surface of the PWB. A preferred method for forming such a PWB comprises: providing a built up high density routing component; providing two wiring boards; laminating the built up routing component between the two wiring boards; and using plated through holes to electrically connect a conductive portion of each of the wiring boards to the built up routing component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.