Control of laser machining
US6586707B2 · kind B2 · utility
30Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Dec 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.