Inventor · Monasterevin, IE

Adrian Boyle

19Patents
9h-index
18Co-inventors
65Inventor score

Filing activity: Dec 23, 1999 → Feb 9, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US7776720B2 Program-controlled dicing of a substrate using a pulsed laser Performing Operations; Transporting 133 Active
US7887712B2 Laser machining system and method Emerging Cross-Sectional Technologies 44 Expired
US6781093B2 Circuit singulation system and method Electricity 37 Expired
US7989320B2 Die bonding Electricity 33 Active
US6841482B2 Laser machining of semiconductor materials Performing Operations; Transporting 33 Expired
US6586707B2 Control of laser machining Performing Operations; Transporting 30 Expired
US6671397B1 Measurement system having a camera with a lens and a separate sensor Physics 23 Expired
US10163213B2 3D point clouds Physics 10 Active
US10116841B2 Relation to underwater imaging for underwater surveys Emerging Cross-Sectional Technologies 9 Active
US10116842B2 Gathering range and dimensional information for underwater surveys Emerging Cross-Sectional Technologies 7 Active
US10158793B2 Processing survey data of an underwater scene Emerging Cross-Sectional Technologies 7 Active
US6697154B2 Microvia inspection system Physics 7 Expired
US6697151B2 Material inspection Performing Operations; Transporting 5 Expired
US6983066B2 Machine vision Physics 4 Expired
US10930013B2 Method and system for calibrating imaging system Physics 3 Active
US10943321B2 Method and system for processing image data Physics 1 Active
US8551792B2 Dicing a semiconductor wafer Performing Operations; Transporting 1 Active
US9352417B2 Increasing die strength by etching during or after dicing Performing Operations; Transporting 0 Active
US8048774B2 Methods and systems for laser machining a substrate Emerging Cross-Sectional Technologies 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.