Patent · US Expired

Semiconductor device and its manufacture

US6586794B2 · kind B2 · utility

11Cited by
2References
14Claims
0Family size

Assignees

Inventors

Key dates

Filing dateMar 15, 2001
Grant dateJul 1, 2003
Priority date
Expiry dateApr 4, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10B12/315

Abstract

A semiconductor device having: a substrate having a first area and a second area surrounding the first area; an insulating film formed in the second area; electrodes formed above the surface of the substrate in the first area; dielectric films formed above the electrodes; and an opposing electrode formed above the dielectric films, wherein the shape of a side wall of the insulating film includes a shape reflecting the outer peripheral shape of a side wall of the electrode facing the side wall of the insulating film. The semiconductor device of high integration, low cost and high reliability can be realized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.