Electronic device substrate assembly with impermeable barrier and method of making
US6587345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device. When incorporated into an electronic module assembly including a module cap, the substrate assembly provides physical separation between a cooling fluid introduced into the module cap, and both the substrate and electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.