System and method for removal of material
US6588437B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2000 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | May 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer.A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing removable material. The apparatus may include first and second assemblies positionable in spaced-apart relation to form a zone extending between the two assemblies for movement of gaseous material. The first assembly may include a fixture positioned to receive the work piece with the reaction region of the work piece disposed in the zone to allow movement of the gaseous material thereover. A flow assembly is configured to transfer into the zone a gas comprising a condensable material and a reacting species.In another embodiment a system for removal of material from a workpiece includes a chamber, a flow component and a support apparatus. The flow component is configured to pass gaseous material into the chamber at a selectable rate and allow exit of liquid and gaseous materials from the chamber. The support apparatus is configured to position the workpiece thereon with the surface region of th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.