Temperature sensor with flexible circuit substrate
US6588931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2000 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Dec 7, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly. The housing either alone or located in an external shell provides a temperature sensor for a particular purpose. In a variation of the flexible circuit sensor assembly, electronic components can be integrated with …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.