Method of manufacturing an electronic power component, and an electronic power component obtained thereby
US6589859B2 · kind B2 · utility
11Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the method, the following are placed in succession on a substrate: at least one conductive layer and at least one semiconductor power circuit, and metal connection tabs are fitted to the face of the semiconductor circuit facing away from the conductive layer by metallizing a metal film. Thereafter, at least one solder element is placed on each film obtained in this way, at least one conductive member is applied to the or each solder element on its side facing away from the metal film, and the or each solder element is caused to melt so as to secure the or each conductive member to the or each metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.