Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating
US6590010B2 · kind B2 · utility
20Cited by
20References
4Claims
0Family size
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Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Jan 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
By blending novel organosiloxane polymers of the invention with a crosslinking agent and a photoacid generator, photo-curable resin compositions are formulated which can be exposed to radiation in a broad wavelength range and readily form a thin film without oxygen attack. From the compositions, fine patterns having improved dry etching resistance can be formed. Cured coatings of the compositions having improved substrate adhesion, heat resistance, and electrical insulation are suitable as a protective film for electric and electronic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.