Lead-free solder paste
US6592020B1 · kind B1 · utility
27Cited by
64References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.