Mark Currie
3Patents
1h-index
9Co-inventors
41Inventor score
Filing activity: Oct 17, 2001 → Jan 6, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6592020B1 | Lead-free solder paste | Electricity | 27 | Expired |
| US8273606B2 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Electricity | 0 | Active |
| US12396818B2 | Friction creating surgical glove | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.