Integrated circuit assembly with bar bond attachment
US6593527B1 · kind B1 · utility
3Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2002 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly 10 is provided, including a substrate 14 having at least one substrate contact surface 18, an integrated circuit device 12 having at least one first contact surface 16, and a bar bond element 22. The bar bond element 22 provides communication between the at least one substrate contact surface 18 and the at least one first contact surface 16. The bar bond element 22 includes a conductive plate element 23 having an integrated circuit foot portion 24, a substrate foot portion 26 and a strain relief loop 46 positioned between the integrated circuit foot portion 24 and the substrate foot portion 26.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.