Gary E. Oberlin
8Patents
6h-index
16Co-inventors
52Inventor score
Filing activity: Nov 8, 1999 → Oct 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7551439B2 | Fluid cooled electronic assembly | Electricity | 72 | Active |
| US7739791B2 | Method of producing an overmolded electronic module with a flexible circuit pigtail | Emerging Cross-Sectional Technologies | 49 | Active |
| US6262489A | Flip chip with backside electrical contact and assembly and method therefor | Electricity | 44 | Expired |
| US6999317B2 | Thermally enhanced electronic module with self-aligning heat sink | Electricity | 20 | Expired |
| US7106588B2 | Power electronic system with passive cooling | Electricity | 9 | Expired |
| US6559763B2 | Frontal impact characterization apparatus for a motor vehicle restraint system | Performing Operations; Transporting | 8 | Expired |
| US6593527B1 | Integrated circuit assembly with bar bond attachment | Electricity | 3 | Expired |
| US7038308B2 | Multi-path bar bond connector for an integrated circuit assembly | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.