Printed wiring board structure with z-axis interconnections
US6593534B2 · kind B2 · utility
8Cited by
7References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Sep 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0554
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.