Protective envelope for a semiconductor integrated circuit
US6593665B2 · kind B2 · utility
0Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Apr 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions set to converge toward each other. The envelope also includes a lead frame embedded in the body and bearing the integrated circuit, the lead frame having a section bent to form a baffle plate orientated toward the first sidewall portion. Advantageously, the bent section of the lead frame has a plane end edge extending parallel to the first sidewall portion at a spacing therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.