Wafer level method for probing micromechanical devices
US6593749B2 · kind B2 · utility
4Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | May 31, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01H9/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Pressurized fluid from a nozzle is applied against the movable member of a micromechanical device, in order to measure the mechanical properties of the device. The technique is non-destructive, non-invasive, can be applied at the wafer, row or die level, and at early or intermediate stages of fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.