Heat sink assembly
US6595275B1 · kind B1 · utility
7Cited by
8References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.