Optoelectronic package with controlled fiber standoff
US6595699B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Sep 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73207
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic component is described that includes a photonic device carried by a substrate. A support structure having a relatively higher portion and a relatively lower portion is formed on or attached to the substrate. In a preferred embodiment, the support structure is a dam structure formed by dispensing a flowable material onto the substrate and hardening the dispensed material. The optoelectronic component further includes one or more optical fibers, with each optical fiber being in optical communication with an active facet on the photonic device. The relatively higher and lower portions of the support structure are arranged to position the optical fiber(s) at a desired standoff distance from the photonic device and to slightly incline the distal tip of each optical fiber relative to the top surface of the photonic device. The described packaging approach can be used in both single fiber and multi-channel devices. In some specific embodiments, the support structure is arranged to engage a fiber termination that holds the optical fiber(s). An optically clear cap may also be provided to cover the active facet of the photonic device. In embodiments where the support struct…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.