Manufacturing method for capacitor having electrode formed by electroplating
US6596149B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1999 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Sep 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A capacitor having an electrode formed by electroplating, and a manufacturing method thereof are disclosed. According to an embodiment of the invention, a conductive film is formed on a conductive plug connected to an active region of a semiconductor substrate, and on an interlayer dielectric (ILD) film formed around the conductive plug. Then, a non-conductive pattern exposing a part of the conductive film on the conductive plug is formed on the conductive film, and a lower electrode, which is formed of a platinum (Pt) group metal, is formed on the conductive film by electroplating. In addition, the lower electrode can have a rectangular, T-shaped, reverse trapezoid or barrel-shaped cross-section. Electroplating can similarly form an upper electrode of the capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.