Polishing method
US6596638B1 · kind B1 · utility
22Cited by
15References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Aug 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items, such as slurries and polishing pads, is reduced. A metal film formed on an insulating film having a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.