Patent · US Expired

Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof

US6597039B2 · kind B2 · utility

19Cited by
17References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 18, 2001
Grant dateJul 22, 2003
Priority date—
Expiry dateDec 18, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76259
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A composite member containing a separation area inside. A mechanical strength of the separation area is non-uniform along a surface of the composite member or along a bonded face. A mechanical strength of a peripheral portion of the separation area is locally low.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.